Service Executive (Layer-3 Board Level Technician)

Job Description

Title: Service Executive (Layer-3 Board Level Technician)

Company Name: BGD Technology

Vacancy: 10

Age: Na

Job Location: Anywhere in Bangladesh

Salary: Negotiable

Experience:

• 2 to 3 years
• The applicants should have experience in the following business area(s): Wholesale, Computer Hardware/Network Companies

• Diploma in Engineering

Diploma / BSc in EEE from a reputed instituteCertified training on Motherboard repairing / Chip level repairing will be preferredHighly experienced candidates may apply regardless of academic background

• 2 to 3 years
• The applicants should have experience in the following business area(s): Wholesale, Computer Hardware/Network Companies

Must be expert in Layer-3 circuit level troubleshootingStrong ability to diagnose & repair:RAM Circuit Level Fault (No display / auto restart / hang / dead RAM line)SSD Circuit Level Fault (No boot / SSD not detected / storage power line issue)Battery & Charging Circuit Fault and battery replace (No charging / not detecting / charging IC issues/backup time low)Knowledge on display fungus removalMust have strong command on:Short circuit detection & solutionVoltage rail checking & signal tracingThermal/overheat component identificationIC replacement & rework knowledgeMust be skilled in using:Multimeter (Diode/Continuity/Resistance)DC Power Supply (Amp draw analysis)Soldering Station & Hot Air Rework StationAbility to handle multiple complex devices daily and meet delivery timeline

1. Complete Layer-3 Board Diagnosis & Repair

   • Proficient in using hardware troubleshooting and diagnostic tools such as RAM debugger, Oscilloscope, PCIe Analyzer, Display Checker, and other related equipment for identifying and resolving technical issues.

   • Perform advanced motherboard fault diagnosis for Laptop/Desktop/Mobile/TV/mac

   • Identify root cause accurately and ensure permanent solution

2. RAM / SSD / Battery Circuit Label Repair

   • Perform chip level troubleshooting for:

     • RAM circuit label repair & related power/line issues

     • SSD circuit label repair & storage detection problems

     • Battery charging circuit label repair and battery replace (charging IC, power path, detection line)

3. Component Level Troubleshooting

   • Replace/repair faulty IC, MOSFET, capacitor, resistor, coil, diode, connectors

   • Perform line tracing & circuit mapping when needed

4. Quality Control & Stability Testing

   • Ensure repaired device stability test (boot test, charging test, performance test)

   • Reduce return/complain ratio through strong QC

5. Customer Handling & Service Reporting

   • Provide accurate service quotation and delivery timeline

   • Maintain service record, daily repair report and pending device tracking